Far Infrared Ray MicroscopeFIR Microscope
Features
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- The far infrared ray microscope camera which combined a magnifier with the far infrared ray camera ULVIPS series.
- It is most suitable for the temperature measurement of the domain micros microscope thermography by carring out calibration with the magnifier.
- Maximum optical resolution 4.25μm/pixel（＊１）As for the magnification,4 kinds are flexible. ＊１：ULVIPS-04272S（Pixel pitch 17um）at the time of x4 magnifer combination
- Minimum temperature resolving power ＜10mK（＊２） ＊２：ULVIPS-03262S（Pixel pitch 25um）x1.25 magnifier combination
- It is settable in a temperature measurement range or temperature resolving power optionally.
- There are three kinds of camera we have which areULVIPS-03162/262S (QVGA:384x288/high sensitivity type) and ULVIPS-04272S (VGA:640x480).
- Frane rate maximum is 50fps・it is possible to take a maximum 2400fps in high-speed by the partial scan.（＊３） ＊３：Is is a frame rate when we use a ULVIPS-04272S as 640 pixel×10 line.
- We have 4 kinds of models for our customer needs.
System basics constitution
Magnifying Glass
With four kinds of lenses, setting of a variety of optics resolving power is possible.
| Optics magnification | Object distance | Correspondence camera | Optics resolving power | Effective 7 | |
|---|---|---|---|---|---|
| x 1.25 | 25mm | ULVIPS-04272S ULVIPS-03162/262S |
13.6um/pix 20um/pix |
F1.1 |  |
| x 2.35 | 15mm | ULVIPS-03162/262S | 10.64um/pix | F2.2 |  |
| x 3.1 | 10mm | ULVIPS-03162/262S | 8.06um/pix | F2.5 |  |
| x 4 | 10mm | ULVIPS-04272S ULVIPS-03162/262S |
4.25um/pix 6.25um/pix |
F2.3 |  |
Example of image output：Aluminum scale
| X1.25 | X2.35 | X3.1 | X4.0 |
|---|---|---|---|
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Example of image output：１０ yen coin
| X1.25 | X2.35 | X3.1 | X4.0 |
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Temperature resolving power
We measure a difference temperature image by a standard hear source.(ULVIPS=04272S+x1.25lens）
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| Temperature difference：４７－３９＝８℃ | Brightness difference（Average）：２５５０－１６５０＝９００ |
| Temperature resolving power＝８÷９００＝９ｍＫ ・・・１０ｍＫ or less | |
High-speed frame rate：Partial scan
Crack examination of semiconductor part・・・A feature appears during heating.
[≫Crack examination of semiconductor part：Movie]
Bundle model with the heat load system
| Heating/cooling stage | Rapid heating stage |
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| Stage size：80x60mm | Stage size：5x5mm |
| Temperature set range：-40～+80℃（It depends on environmental temperature） | Temperature set range：room temperature～+600℃ |
| The biggest temperature incline：about 0.3℃/sec. | arrival time：30sec to +400℃ （There are other characteristic heaters, too) |
| →It is most suitable for the inspection in the static temperature state. | →It is most suitable for the inspection in the dynamic temperature state. |
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